So, our reflow profile does match the solder paste specification. Reflow Profile: Two unique profile families are depicted below both can be used in ramp-spike or ramp-soak-spike applications, and they each have similar reflow temperatures. The cooling ramp rate, from Figure 2, is (250-90)☌/(5.7-3.8) min = 160☌/(114 sec) = 1. 40☌/sec, which is within the acceptable rate of the solder paste spec. The peak temperature is 250☌, again within the specification recommended range as seen in Figure 1. There is no “soak” in this profile, so we can ignore this part of the solder paste spec.įrom Figure 2, the time above liquidus is 4.4 – 3.1 minutes (78 Seconds), right within the recommended range of the solder paste spec. This result is just over the recommended spec, but within the acceptable spec as seen in Figure 1. Ramp Profile: From Figure 2, the oven goes from room temperature to liquidus in 3.1 minutes (186 seconds) this gives a slope of (219 – 25)☌/(186 - 0 ) sec = 194/186 = 1.04 ☌/sec. Now, let’s take each reflow profile requirement individually: The solder paste reflow specification is shown in Figure 1 below.įurthermore, let’s assume that we have a reflow profile that we have used in the past, as seen in Figure 2. Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. The external air pressure supply should be maintained constant. M8 - Solder Paste from AIM Metals & Alloys LP. NC257MD prolongs ejector life and reduces paste scrap and consumption. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. Post-Process residues have undergone testing to insure high insulation resistance, and may be left on the PCB without degradation. DJAW-10 will not dry M8 and will enhance transfer properties. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. DJAW-10 can be hand applied or used in under stencil wipe equipment. AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. CLEANING Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process. The RMA-201 formulation is designed specifically to allow reflow at higher than normal temperatures. See AIM’s paste handling guidelines for further information. SMT Supplies is your best source for AIM No-Clean solder paste. Sign In or Create An Account for Volume discounts. Assume we want to start using Indium Corporation’s Indium8.9HF Pb-Free Solder paste. In cases where a paste requires much higher pressure (more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging may be expected. NC257MD solder paste has been specifically developed for Mycronic Jet Printers. RMA-201 is a mildly activated, pure gum rosin solder paste that is QQS571-E, QPL approved. AIM M8-SAC305-T4 No Clean Lead Free Solder Paste, 500 Gram Jar. NC257-2 was developed for use in air reflow, but can be used in both N2 and vapor-phase reflow processes as well. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Matching a reflow profile to a solder paste spec is a required skill for an SMT process engineer. NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. PTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY LAYOUT OR OTHER PROCESS VARIABLES. AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. SiP & Heterogeneous Integration & Assembly (HIA).The Indium Corporation & Macartney Family Foundation.NC258 Sn62 T4 Paste 500 gr jar €60.29 Add to cart.NC258 SAC305 Type 5 J5 Paste 500 gr jar €69.32 Add to cart.Improved Wetting Versus All Low/No-Silver Alloys.Reliability Equal to Sn/Ag/Bi/Sb/Ni/Cu Alloys with Wider Assembly Process Window.Enhanced Durability for Use in Extremely Harsh Environments.This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. REL22 is the solution when SAC alloys are incapable of surviving in harsh environments, such as automotive,Īerospace and geographical exploration equipment. Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It provides significantly improved durability for use in applications where thermal shock, vibration and high g-forces are a concern. AIM M8 REL22™ type 4 solder paste in 500 gr jar. REL22™ alloy has been specially developed by AIM for high reliability applications.
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